Rockwell Demonstrates Capabilities at Pack Expo

Rockwell Automation will demonstrate at Pack Expo 2010 how machine builders can lower their total cost to design, develop and deliver packaging machinery using a scalable, multidisciplined control and information system. Featuring innovative new control and safety capabilities, the Rockwell Automation Integrated Architecture system integrates process to packaging machinery, helping end users gain real-time insight into their operation and succeed in today's knowledge-based business environment.

"Manufacturers face the ever-present challenge of integrating processing and packaging lines so product flows in a continuous, efficient manner," said Mike Wagner, global packaging business manager, Rockwell Automation. "OEMs that choose a fully integrated control and information platform can seamlessly bridge machinery and create an environment for their end user customer to more easily optimize line performance."

The Rockwell Automation booth (N-3972) at Pack Expo will feature several additions to its control and information platform including automation controllers, servo drives, AC drives and a mechatronics display.