Soft paste-type thermal gel from Advanced Antivibration Components (AAC) features thermal conductivity up to 6.5W/m • K. This RoHS controlled substance is used to fill gaps around heat sources, such as high-performance semiconductors. Other applications involve surface, underside, and lead heat sources such as IC's. The paste is most popular for use where it is difficult to fix sheet-type thermal gel. These applications include: computer internal components, power supplies, power transistors, and other heat producing components.
There are 3 types of gels, identified as the V30Z63MDP Series, which come in a syringe to make for easier application. They feature high specific volume resistance ratio up to 7.2x1014 W • cm; low dissipation factor down to 0.0004 at 1MHz; and high breakdown voltage up to 9.6 kv/mm. They contain nothing harmful and are therefore considered environment-friendly. At the AAC eStore you can check price and availability, place an online order, download 3-D models or request a quote at anytime.
Additional technical specifications are contained in Catalog V110 available free upon request from Advanced Antivibration Components.