Hannover Messe Preview: CoorsTek

Semiconductor Vacuum Chuck.

Semiconductor Vacuum Chuck.

March 26, 2019—
CoorsTek will present the latest developments in technical ceramics during Hannover Messe 2019.
 
“We are pleased to support the semiconductor industry and its new requirements for energy-efficient sensing, automated devices, robotics and artificial intelligence,” said Andreas Schneider, executive vice president, Europe. “Our technical ceramics components are engineered to support virtually every step of the semiconductor manufacturing process – improving yields, increasing throughput and enabling smarter devices.  This in turn enhances our customers’ competitive advantage and drives growth.” 

CoorsTek will present the following new developments at the show:

CoorsTek is currently developing an unconventional shaping method to produce components with more complex features to support the industry’s growing need for bigger and more complex semiconductor components. These new molding and pressing technologies are easily scalable and ideal to support the semiconductor industry. The new CoorsTek shaping method allows customers to quickly adapt both their part design and production volumes according to the market needs.

CoorsTek recently developed molding methods allowing manufacturers to design parts with more complexity and additional features. This technology enables product designers to integrate multiple functions and decrease the number of components reducing manufacturing assembly phases and time-to-market. 

More sophisticated semiconductor systems are demanded to fulfill growing needs for bigger data collection, data storage, and memory. CoorsTek is investing in its manufacturing sites and resources to meet the growing needs for high-purity alumina oxide semiconductor components in the US, Europe, and Asia. The Gumi, Korea facility expansion is the biggest coordinated expansion of operations in CoorsTek history, increasing the manufacturing capacity of the facility to over 9,000 sqm.  

In addition, CoorsTek’s latest developments will help the automotive industry to drive performance and sustainability with the following new materials:

The silicon nitride (SiN) Cerbec bearing elements are especially valuable in applications where steel balls degrade rapidly or where electrical insulation is a necessity. CoorsTek has developed two new SiN bearing grades, SN102 and SN103, to complete its existing bearing elements offer:

SN102 meets the requirements of ASTM F2094 Class I, and is especially suitable for high-contact stress applications such as machine tool and aerospace applications.

SN103 is suitable for medium contact stress applications such as electric motors, generators,  and e-mobility applications. SN103 meets the requirements of ASTM F2094 Class II. 

Visit Hall 3, Booth M03 or Hall 22, Booth A33 to learn more during the show.

CoorsTek
Phone: 
(855) 929-7100
URL: 
www.coorstek.com