Rockwell Demonstrates Capabilities at Pack Expo
October 27, 2010—
Rockwell Automation will demonstrate at Pack Expo 2010 how machine builders can lower their total cost to design, develop and deliver packaging machinery using a scalable, multidisciplined control and information system. Featuring innovative new control and safety capabilities, the Rockwell Automation Integrated Architecture system integrates process to packaging machinery, helping end users gain real-time insight into their operation and succeed in today's knowledge-based business environment.
"Manufacturers face the ever-present challenge of integrating processing and packaging lines so product flows in a continuous, efficient manner," said Mike Wagner, global packaging business manager, Rockwell Automation. "OEMs that choose a fully integrated control and information platform can seamlessly bridge machinery and create an environment for their end user customer to more easily optimize line performance."
The Rockwell Automation booth (N-3972) at Pack Expo will feature several additions to its control and information platform including automation controllers, servo drives, AC drives and a mechatronics display.