Emerson will present new solutions that drive operational excellence in packaging and food and beverage processing applications at PACK EXPO International 2022 on October 23-26 in Chicago. Today’s packaging lines must accommodate an unprecedented level of product variety and packaging complexities, but there are powerful automation capabilities that can significantly improve productivity, efficiency and sustainability for consumer-packaged goods (CPG) companies. Emerson’s tools, technology and expertise can help packaging and production lines reduce waste, empower decision making, improve facility safety, sharpen the accuracy of critical measurements, increase machine availability and much more. 

Emerson announced the recipient of its 2022 ASCO Engineering Scholarship Program, which recognizes and rewards U.S. college and university students studying in the fields of engineering, instrumentation, systems, and automation, for their academic excellence, service to others, and leadership potential.