Distributed servo drives, compact IPCs and TSN-ready I/O systems top the list of new smart factory solutions from Beckhoff Automation. The company will demonstrate its new AMP8000 distributed servo drive system alongside its complete lineup of automation hardware, software and networking solutions at Pack Expo 2018 in Chicago. Beckhoff will showcase packaging machine control systems that can power the smart factory of today in booth S-3183 at the McCormick Place convention center’s south building during the trade show, which is expected to draw 50,000 global attendees from more than 40 vertical markets from October 14 – 17, 2018.
Additionally, Beckhoff has back-to-back presentations at the Innovation Stage during Pack Expo. Beckhoff will present on new data analytics technologies for deployment on packaging machine controllers. On Tuesday at 2:00 pm (Booth N-4560), be sure to attend: “Onboard Machine Analytics Yield Actionable Data Insights in the Packaging Industry.” Directly following this presentation in booth N-4570, Beckhoff will present on the latest advances in distributed drive technology. Don’t miss the second Beckhoff presentation at 3:00 pm, “Smaller Packaging Machines With Fewer Enclosures Using Distributed Drive Technology.”
Pack Expo Presentations:
Tuesday October 16 | 2:00 pm | Innovation Stage | Booth N-4560 Presented by: Daymon Thompson | Automation Specialist, North America
Tuesday October 16 | 3:00 pm | Innovation Stage | Booth N-4570 Presented by: Matt Prellwitz | Drive Technology Application Specialist, North America